Paibo Technology
Paibo Technology is a high-power chip electronic ceramic heat dissipation packaging solution provider.
About Paibo Technology
Paibo Technology is a high-power chip electronic ceramic heat dissipation packaging solution provider.
Company Facts
- Headquarters
- Jiangdu
- Operating Status
- active
- Company Type
- for_profit
- IPO Status
- private
- Funding Stage
- early_stage_venture
- Total Funding
- $21,149,698
- Last Funding Type
- series_a
- Last Funding Date
- 2024-09-05
Industries & Categories
Application Specific Integrated Circuit (ASIC), Electronics, Manufacturing, Semiconductor
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